| 摘要 |
PURPOSE:To reduce the height of a loop of a wire, to reduce the thickness of a semiconductor device and to decrease the cost by bending the wire directly above the first bonding position of a wire bonding, extending the wire and performing the second bonding. CONSTITUTION:A wire 16 is connected between an electrode pad 15 of an element pellet 14 and a wiring circuit 11 of a printed circuit board 10 to electrically connect the both, and the pellet 14 and the wire 16 are sealed with resin 17. The wire 16 is bent substantially at a right angle at the position directly above the first bonding position B1, and extended to the second bonding position B2 in the extended state, and the second bonding is executed. In this manner, the loop height H2 of the wire can be reduced, and the thickness of the entire semiconductor device can be reduced. The wire 16 is formed of extrafine wires of aluminum alloy, and can be readily bent. |
