WIRE BONDING METHOD

摘要

PURPOSE:To increase considerably the loop height of a bonded wire by inducing plural times of arc discharge between the top end of a high tension gold wire and an electric torch and increasing the length of the recrystallized part to be continuously formed in the ball part. CONSTITUTION:A high tension gold wire 18 is used, and plural times of arc discharge are induced between the top end thereof and an electric torch 16 to form a ball part 23. The heat energy generated by the discharge is successively transmitted to the wire 18 continuous with the part 23 to accelerate recrystallization. The diameter of the part 23 is made approximately the same as the diameter of the ball formed by one discharge and the length of the recrystallized part formed to the wire 18 is made about >=1.5 times the length in the case by the one discharge. The height (h) of the wire loop from the ball bond part 23B to edge bond part formed on the connecting end part 22 of a semiconductor element 21 is then increased. The contact accident of the high tension gold wire in high speed bonding is thus made possible.