发明名称 STRUCTURE OF THERMAL HEAD
摘要 PURPOSE:To obtain excellent printing quality by reduced power, by embedding a conductor in a ceramic substrate so as to flush the surface thereof with the surface of the ceramic substrate in a stepless state. CONSTITUTION:The pattern of a conductor 2a is embedded in a groove 5 having the same configuration. Said groove can be easily formed by a method wherein a mold having the same reversal configuration as the conductor pattern is pressed to a green sheet comprising a ceramic substrate 1 and hot-press is performed to obtain a green sheet which is, in turn, baked. The conductor 2a having the same pattern is printed to this grooved substrate 1. When positional alignment is difficult, the conductor 2a is entirely printed to said substrate 1 and, after drying and baking, subjected to surface polishing while all of the conductor 2a adhered to the place other than the groove is shaved off and the surfaces of the conductor 2a and the substrate 1 are made flush. A resistor 3 comprising ruthenium oxide or tin oxide is formed to the surface of thus obtained substrate 1 and a surface coating 4 is applied thereon. In printing, the heat generating resistor 3 and heat sensitive paper can be closely adhered and, therefore, heat efficiency is extremely enhanced.
申请公布号 JPS59167274(A) 申请公布日期 1984.09.20
申请号 JP19830040663 申请日期 1983.03.14
申请人 HITACHI SEISAKUSHO KK 发明人 YAMAGISHI YUTAKA;OIKAWA SHIYOUJI
分类号 H05K1/16;B41J2/335 主分类号 H05K1/16
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