| 摘要 |
PURPOSE:To provide a soldering device which can stick throughly a solder melt on a printed circuit board by the constitution in which many rugged liquids formed on the peaks of the solder melt gushing from a jet type solder tank housed disposed in a secondary tank of two successively arranged solder tanks are moved in the direction intersecting with the traveling direction of the printed circuit board. CONSTITUTION:The solder melts 8, 9 in a primary tank 6 and a secondary tank 7 are pressurized respectively by the rotation of impellers 13, 20, and are fed into overflow tanks 11, 18. A plane solder surface 8a is formed in the upper part by the melt 8 entering the tank 11 of a floating type solder tank 10 and is returned by overflowing 12 into the tank 6 so that the melt is circulated 15 into the tank 11. On the other hand, the melt 9 entering the jet tank 18 of a jet type solder tank 17 is run in an arrow B direction through the screw part of a rotating body 24 and is ejected from jet ports 19. Many rugged waves 9b are formed on the peak of the jet wave 9a in the direction intersecting with the traveling direction (arrow A direction) of a printed circuit board 1. On the other hand, the board 1 conveyed into a soldering device 3 is lowered diagonally from an arrow A1 direction to an arrow A2 direction in the tank 10 and is immersed in the surface 8a to solder preliminarily electronic parts 2 and thereafter the circuit board is soldered in the tank 17. |
