METHOD FOR BONDING ELECTRICAL CONDUCTORS TO AN INSULATING SUBSTRATE
摘要
Electrical conductors (30) are bonded to an insulating substrate (10) by partially embedding granulated electrically conductive material (22) in said insulating substrate to provide exposed unembedded portions thereof, and binding the exposed portions of said partially embedded granules (34 and 36) in an electrically conductive matrix.
申请公布号
WO8403586(A1)
申请公布日期
1984.09.13
申请号
WO1984US00298
申请日期
1984.02.29
申请人
MITCHELL, DENNIS, R.;MITCHELL, JAY, R.;ROSKO, JOHN
发明人
MITCHELL, DENNIS, R.;MITCHELL, JAY, R.;ROSKO, JOHN