发明名称 SEMICONDUCTOR BONDING APPARATUS
摘要 PURPOSE:To smoothly tranfer the frames and realize good bonding by fixing a lead frame with a heater block and frame holding member and by providing a frame support block which is placed in contact with the lower surface of pattern in the region having the specified width and supports it. CONSTITUTION:A frame support block 14 is supported with an inclination by a slide bearings 15, 15,... and a slide bearing housing 16 which supports said slide bearings, the slide bearing is lifted with elasticity by a spring 17 and is then abutted with a frame support stopper 19 for positioning by a roller holder 18 mounted to the lower end of this bearing. A frame holding member 22 moves downward, holding and positioning the pattern of lead frame between the upper surface of heater block 12 and the upper surface of frame support block 14 disposed in such a way that the upper surface of it is located on the same plane as the surface of said heater block. After conducting the bonding during this period, the upward movement is carried out in synchronization with downward movement of frame support block 14 and each timing of frame feeding. This cynchronization is ensured by a frame support upper and lower cam 20 and coaxial cam, etc.
申请公布号 JPS59150438(A) 申请公布日期 1984.08.28
申请号 JP19830022791 申请日期 1983.02.16
申请人 TOSHIBA KK 发明人 KACHI KAZUO
分类号 H01L21/52;H01L21/60 主分类号 H01L21/52
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