| 摘要 |
<p>PURPOSE:To reduce the amount of a hardening accelerator largely or to make the amount to be none and to form a semiconductor device having excellent reliability, by using a specified epoxy resin composition, and sealing a semiconductor element. CONSTITUTION:An epoxy resin composition includes an epoxy resin (A component) and a phenol resin (B component). Both ends of a molecular chain of polymethylsiloxane oligomer (C component) are formed by a heterocyclic compound residue, which has at least two secondary amino groups within a molecule. The chain part of the molecular chain is bonded to nitrogen in the second- class amino group in either of the end residues. An addition reaction product (D component) is formed by the polydimethylsiloxane oligomer, wherein both ends of the molecular chain are formed by a heterocyclic compound residue having at least two secondary amino group and the chain part of the molecular chain are bonded to the nitrogen in the secondary amino group in either of said residue parts at both ends, and a compound having at least two epoxy resin in a molecule.</p> |
