发明名称 SOLDER RESIST DETECTING METHOD
摘要 PURPOSE:To view exactly a solder resist whose coating is thin by mixing a fluorescent material into a synthetic resin of a solder resist, and generating a fluorescence by irradiating an ultraviolet ray. CONSTITUTION:A through-hole 5 for inserting a lead of parts loaded on a face A of printed board is provided on a land 3 of an electric conductor pattern of a face B of an insulating plate 1 of the printed board, and in order to detect an existence of a thin film 6 of a solder resist 4 which becomes a fault when the lead of parts is connected by solder in the land 3 part, a fluorescent material is mixed in advance into a synthetic resin of a solder resist. A thin film 6 of the solder resist 4 is detected visually by irradiating an ultraviolet ray of an ultraviolet lamp 8.
申请公布号 JPS59145950(A) 申请公布日期 1984.08.21
申请号 JP19830019196 申请日期 1983.02.08
申请人 FUJITSU KK 发明人 TAKAMATSU SHIGEO
分类号 G01N21/64;H05K1/02;H05K3/34;(IPC1-7):G01N21/64 主分类号 G01N21/64
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