| 摘要 |
PURPOSE:To prevent deterioration in characteristics of a chip even when a package decreases in thickness by injecting resin which forms an elastic body even after curing so that a ceramic substrate, bubble chip, and coils are covered, and injecting resin with high mechanical strength outside of it. CONSTITUTION:A figure (a) shows the points of the packaging of the bubble chip 2 to the ceramic substrate 1 and the attachment of coils 3 and 4. They are inserted into a frame material 5 as shown by (b) and the substrate 1 is connected fixedly to lead terminals 6; and the resin 7 is injected covering all members in the frame material 5 and cured, but the injected resin 7 reaches neither the upper nor lower end of the frame material 5 in this case. Then, the resin 10 having sufficient strength such as epoxy resin is injected outside of the resin 7 in the frame material 5 as shown by (c) so that it reaches the top and reverse surfaces of the frame material 5 and cured thus completing molding. In this molding, magnets and homogenizers are embedded in the top and reverse surfaces of the resin 10. |
