发明名称 PARTIAL PLATING DEVICE
摘要 PURPOSE:To provide a titled device which can assure a uniform plating thickness at a low cost by the constitution wherein an annular narrow gap is formed around the tip of a nozzle to form a discharging port for a plating soln. and the plating soln. is filled in the space between the tip of the nozzle and a material to be plated. CONSTITUTION:A material 1 to be plated is placed, via a mask 3 having an aperture 3a of the shape regulating a plating area on a mask supporting plate 4 having an aperture 4a of the space approximately equal to the plating area and is exactly positioned by means of guide pins 7; further the mask plates and the material to be plated are brought into tight contact with each other, via an elastic plate 6, by a pressing plate 5. On the other hand, an adjusting plate 8 having a circular-shaped aperture is fitted in the opening 4a of the plate 4 and an auxiliary cylinder 9 is inserted to the tip of a nozzle 2 to adjust the height of the nozzle 2 and to form an arrow toric gap 10 between the cylinder 9 and the plate 8. A plating soln. supplied from the nozzle 2 is ejected in this state from the tip of the cylinder 9 and is filled in the space between the same and the material 1, then the soln. is discharged from the gap 10 and electricity is conducted between the material 1 and an electrode (not shown), whereby plating is performed.
申请公布号 JPS59126771(A) 申请公布日期 1984.07.21
申请号 JP19830004319 申请日期 1983.01.11
申请人 SUMITOMO KINZOKU KOUZAN KK 发明人 USUI YASUO;WADA KEISUKE
分类号 C23C2/00;C23C18/16;C23C18/18;C23C18/31;C25D5/02;H01L23/50 主分类号 C23C2/00
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