发明名称 |
Resistance reflow soldering apparatus |
摘要 |
A small-sized light-weight resistance reflow soldering apparatus for modifying the wiring pattern on a printed circuit board, with the soldering apparatus including a heating device with an adjustable weight, a supporting mechanism for a vertically movably supporting the heating device, a welding power supply for making the heating device produce heat enough to melt the solder for a predetermined time length, and a case accomodating these constituents. The soldering is effected by the heating device which produces the heat while being pressed against the jointing surface.
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申请公布号 |
US4460817(A) |
申请公布日期 |
1984.07.17 |
申请号 |
US19820387665 |
申请日期 |
1982.06.11 |
申请人 |
HITACHI, LTD. |
发明人 |
TANI, MITSUKIYO;KAWASHIMA, SEIICHI |
分类号 |
H05K3/34;B23K1/00;B23K3/00;B23K3/04;(IPC1-7):B23K1/12 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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