| 发明名称 |
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE |
| 摘要 |
A light emitting device includes: a semiconductor light emitting element having a sapphire substrate and a semiconductor layer; a mounting board; and a light transmission member, wherein: the sapphire substrate is bonded to the light transmission member by an adhesive material; the semiconductor light emitting element is mounted on the mounting board in the form of a flip-chip; and a roughened peripheral edge part is formed in the sapphire substrate in the mounting board side. |
| 申请公布号 |
US2016276557(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201615073291 |
申请日期 |
2016.03.17 |
| 申请人 |
TOYODA GOSEI CO., LTD. |
发明人 |
WADA Satoshi;Taniyama Yoshiki |
| 分类号 |
H01L33/58;H01L33/00;H01L33/48;H01L33/22 |
主分类号 |
H01L33/58 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device including:
a semiconductor light emitting element having a sapphire substrate and a semiconductor layer; a mounting board; and a light transmission member, wherein: the sapphire substrate is bonded to the light transmission member by an adhesive material; the semiconductor light emitting element is mounted on the mounting board in the form of a flip-chip; and a roughened peripheral edge part is formed in the sapphire substrate in the mounting board side. |
| 地址 |
Kiyosu-shi JP |
