发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To enable in-process monitoring of the thickness of a sputtering film with high accuracy by enclosing a film thickness sensor and the signal line thereof with a shielding case and eliminating the influence of the high frequency used for sputtering. CONSTITUTION:A sputtering device consists of a sputtering target 4 continuous with a high frequency power source, a substrate holder 5, a film thickness sensor 6, and a shielding case 13 having the opening of a metal screen 14 formed of a conductive material. Said sensor 6 has a crystal oscillator placed oppositely to the target 4. Said case 13 encloses the sensor 6 and the signal wire thereof and the opening of the case 13 allows the passage of sputtering particles to the target 4 side, thereby blocking high frequency noise.
申请公布号 JPS59118884(A) 申请公布日期 1984.07.09
申请号 JP19820234347 申请日期 1982.12.24
申请人 HITACHI SEISAKUSHO KK 发明人 HARA SHINICHI;HANAZONO MASANOBU;AKIYAMA HIROSHI;KAWAKAMI HIROJI
分类号 C23C14/40;B01J19/08;C23C14/54 主分类号 C23C14/40
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