发明名称 CONFRONTING TARGET TYPE SPUTTERING DEVICE
摘要 PURPOSE:To provide a target which can improve the using efficiency of targets placed opposite to each other in parallel by the constitution wherein cores disposed with permanent magnets are provided around said targets to generate the magnetic field enclosing the space between the targets. CONSTITUTION:Targets T1, T2 which act as cathode in a vacuum vessel 10 are held opposite to each other in parallel by means of target holders 11, 12, and cores 301, 302 are provided, via insulating spacers 15, 16, around the targets. Permanent magnets 301', 302' for generating a magnetic flux to the cores 301, 302 are installed on the outside part of the leg parts 301b, 302b of said cores to generate a magnetic field H enclosing the space between said targets T1 and T2. Plasma density is then made uniform over the entire surface area of the targets T1, T2 whereby a film is formed at a high speed on a substrate (not shown in figure) disposed alongside the magnetic field H and the targets T1, T2 are uniformly sputtered. The cores 301, 302 are connected to the vessel 10 to function as a shield and the magnets 301', 302' are disposed on the outside part of the vessel 10 to make the device compact.
申请公布号 JPS59116376(A) 申请公布日期 1984.07.05
申请号 JP19820223899 申请日期 1982.12.22
申请人 TEIJIN KK 发明人 HONSHIYOU KAZUHIKO;KADOKURA SADAO
分类号 C23C14/34;C23C14/35;C23C14/36;H01J37/34 主分类号 C23C14/34
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