发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable to effectively operate the cutting off function of the entire semiconductor device by converting an electrode on the uppermost layer having a defect into an insulator such as oxide, nitride or carbide so that no main current flows to the region of this part. CONSTITUTION:A protective film 7 is enclosed on a semiconductor piece 1 and a substrate 2 except an aluminum 5a on an emitter having a defect and lead wire lead 4a of gate electrodes, this semiconductor device is dipped in a beaker 11, in which electrolyte 10 such as sulfuric acid solution is filled, a power source 13 is connected between an electrode 12 and the aluminum electrode 5a to perform an anodic oxidation, thereby converting part or full of the electrode 5a into alumina.
申请公布号 JPS5998555(A) 申请公布日期 1984.06.06
申请号 JP19820208194 申请日期 1982.11.27
申请人 FUJI DENKI SOUGOU KENKYUSHO:KK;FUJI DENKI SEIZO KK 发明人 OOHIRA KENYA
分类号 H01L29/73;H01L21/28;H01L21/316;H01L21/331;H01L29/74;H01L29/744 主分类号 H01L29/73
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