| 摘要 |
PURPOSE:To ensure the width size of a root section in a lead on the most terminal side, and to reinforce leads by each forming the external end surfaces of the lead on the most terminal side and a lead one lead inner in a plurality of the leads into a rectilinear shape and making the width size of a root section of the lead smaller than that of the root section in the lead on the most terminal side. CONSTITUTION:With external lead sections 20 on the most terminal sides, nose sections 20a are projected from the outsides of root sections 20b, and external end surfaces 20c are constituted into a rectilinear shape. With external lead sections 21 on the sides inner than the external lead sections 20 by one, external end surfaces 21c are formed into the rectilinear shape, and the width size of root sections 21b is organized in size smaller than the root sections 20b in the external lead sections 20. With other external lead sections 22, the width size of root sections 22b is composed in the same size as that of the root sections 20b in the external lead sections 20. When the external lead sections 20 for adjacent semiconductor devices are brought into contact mutually, the external lead sections 20 are reinforced by the root sections 20b, thus preventing bending, then generating no bending of the external lead sections 21 protected by the external lead sections 20 on the most terminal sides. |
