发明名称 CUTTING METHOD OF CERAMIC USING LASER
摘要 PURPOSE:To enable manufacture of a long-sized heating substrate for a telefacsimile or the like in the stage of irradiating laser light on the surface of a work and forming a cutting line by inclining adequately the angle of the irradiation thereby obtaining the cutting surface square to the surface of the work. CONSTITUTION:Laser light 23 is irradiated to a ceramic material 20 with an inclination of, for example, about 15 deg. to the material 20 side in the stage of butting short substrates and manufacturing a long-sized heating substrate for a telefacsimile or the like. The material 20 is then divided always at the line III-VI-IV and a molten deposit 15 does not project from the surface VI-IV square to the material 20, thus the material is divided to an effective material 20 and an ineffective material 20'. Therefore if the effective materials 20 are butted on each other, the space-less surface M is obtd. irrespectively of the presence of the deposit 15, whereby the long-sized material is formed.
申请公布号 JPS5987991(A) 申请公布日期 1984.05.21
申请号 JP19820196833 申请日期 1982.11.11
申请人 MATSUSHITA DENKI SANGYO KK 发明人 IWAGUCHI YASUTADA
分类号 B23K26/00;B23K26/38;B23K26/40 主分类号 B23K26/00
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