发明名称 MULTILAYER WIRING STRUCTURE
摘要 PURPOSE:To reduce the crosstalk between connecting wires by composing to superpose four wiring layers of different wiring groups directions, thereby shortening the length of connecting wires. CONSTITUTION:A first wiring layer 13x having x-direction wiring group, a second wiring layer 13y having y-direction wiring group, a third wiring layer 13a having parallel wiring groups of angle of 45 deg., and a fourth wiring layer 13b are superposed through insulating layers to form a wiring lattice 13. Thus, the length of connecting wires can be shortened by using the segments 17, 19 of wires 13y of the second wiring layer for connecting between the terminals 14 and 15, and the segment 22 of the wires 13a of the third wiring layer connected through holes 20, 21.
申请公布号 JPS5986248(A) 申请公布日期 1984.05.18
申请号 JP19820197206 申请日期 1982.11.08
申请人 MITSUBISHI DENKI KK 发明人 NODA TOMOYOSHI
分类号 H01L21/3205;H01L21/82;H01L23/52 主分类号 H01L21/3205
代理机构 代理人
主权项
地址