发明名称 HEAT TREATMENT DEVICE
摘要 PURPOSE:To take in and out a boat, on which a material to be treated such as a wafer is arranged and held, positively and easily without being slid on the inner surface of a pipe device such as a core pipe in treatment using the so-called horizontal type heating furnace, such as thermal diffusion treatment, CVD treatment or annealing treatment or the like. CONSTITUTION:The wafers 3 are arranged on the boat 41, and an operating rod 53 is moved in the horizontal direction (a) and brought close to the boat 41. When the second contact section 58 of a second mounting section 59 is brought into contact with the first contact section 14 of a first mounting section 52, the operating rod 53 is moved in the upward vertical direction (b), and second connecting sections 56, 57 are connected to first connecting sections 50, 51. The operating rod 53 is moved continuously in the upward vertical direction, and moved in the horizontal direction (a) again, and the boat 41 is inserted into the core pipe 40. When the boat 41 reaches to a proper position in the core pipe 40, the legs of the boat 41 reach the inner wall of the core pipe 40 when the operating rod 53 is moved slowly in the direction opposite to the arrow (b), and the connections of the connecting sections 50, 51; 56, 57 are released. The operating rod 53 is moved in the direction oppsite to the arrow (a), and the operating rod 53 is drawn out of the core pipe 40. The wafers 3 placed on the boat 41 are thermally treated in the core pipe 40.
申请公布号 JPS5984540(A) 申请公布日期 1984.05.16
申请号 JP19820195591 申请日期 1982.11.08
申请人 SONY KK 发明人 KATOU TOSHIROU
分类号 C23C16/54;H01L21/22;H01L21/31;H01L21/673;H01L21/677;H01L21/68 主分类号 C23C16/54
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