Epoxy resin adhesive compositions

摘要

The present invention relates to a room temperature curable epoxy resin adhesive composition having excellent T-peel strength, comprising an epoxy resin containing more than one epoxy group in a molecule on an average, and a hardener in the form of a polyamide-amine, which is obtained from reaction of polyamine with diene rubber having carboxyl terminal groups and other compound having carboxyl groups.