| 摘要 |
PURPOSE:To improve the adhesive property of a glass protective film and a semiconductor surface by roughening a section, to which the glass film is formed, of a semiconductor. CONSTITUTION:When the surface of a semiconductor board, the inside thereof has a junction, is chemically treated finally and molded and a molding section is coated with the glass protective film, the section coated with the glass film is roughened through the spray-up of sand or similar materials before final chemical treatment, the adhesive property of the glass film and the semiconductor surface is improved, and the generation of cracks in the glass film and the exfoliation of the glass film are prevented. A semiconductor pellet 1, to which the P-N junction is formed, is used, and grooves 2 are formed by repeating a sand blast by a nozzle and the spray-up of a mixed acid by a nozzle. A sample in which the grooves 2 are buried with glass displays characteristics more excellent than samples with conventional resin protective films in an initial characteristics test and a repetition load reliability test. |
