| 摘要 |
A substrate board carrying circuit components is fastened to the plastic carrier frame of an electronic timepiece at one location by an elongated battery spring contact which is affixed to the carrier frame such as by adhesive and which passes through aligned passages provided through both the frame and substrate board, eventually terminating beyond the substrate board in a contact post where a solder bead is applied functioning not only as a connection to the circuitry on the substrate board but also as a retaining head holding the substrate board to the carrier frame. Preferably, the substrate board and carrier frame are held together at a second location by a stab joint arrangement wherein a protrusion on either the board or frame is received in a corresponding recess in the other member. |
