发明名称 Integrated semiconductor chip
摘要 In an integrated semiconductor component, a strip-type conductor (5) extends transversely to, and in contact with, a multiplicity of electrical components (3, 4). One of the films is thinner than the other, or discontinuous, in the insulation zones between the electrical components in order to eliminate thermal stresses. <IMAGE>
申请公布号 DE3323433(A1) 申请公布日期 1984.02.23
申请号 DE19833323433 申请日期 1983.06.29
申请人 MITSUBISHI DENKI K.K. 发明人 MATSUKAWA,TAKAYUKI;ARIMA,HIDEAKI
分类号 H01L23/52;H01L21/3205;H01L23/528;H01L27/10;(IPC1-7):01L23/52;01L27/04;11C17/00;11C11/40 主分类号 H01L23/52
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