发明名称 |
Method for forming dense multilevel interconnection metallurgy for semiconductor devices |
摘要 |
A method for providing high density multiple level metallurgy for integrated circuit devices in which a relatively thin layer of plasma produced silicon nitride is deposited over a first level of interconnection metallurgy formed on a layer of silicon oxide. Overlap via holes are etched in the nitride layer followed by deposition of a thicker layer of polyimide forming polymer. A second set of via holes larger than the first are provided in the polymer layer and a second layer of interconnection metallurgy is then deposited by a lift-off deposition technique. |
申请公布号 |
US4423547(A) |
申请公布日期 |
1984.01.03 |
申请号 |
US19810269230 |
申请日期 |
1981.06.01 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FARRAR, PAUL A.;GEFFKEN, ROBERT M.;KROLL, CHARLES T. |
分类号 |
H01L23/522;H01L21/027;H01L21/28;H01L21/768;(IPC1-7):H01L21/04 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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