摘要 |
The resin composition comprises (a) a light-polymerizable compound having at least one ethylenically unsaturated double bond (100 parts by weight), (b) an organic filler material (0.1 to 90 parts), (c) a light polymerization initiator (0.001 to 5 parts), and (d) a reducing agent (0.01 to 10 parts). The light-polymerizable compound is preferably solid at room temperature, and may be a mono-or poly-functional acrylate or methacrylate. The organic filler may be a synthetic resin powder, e.g. of polymethyl methacrylate, polypropylene or styrene-butadiene copolymer.
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申请人 |
G-C TOSHI KOGYO CORP., KASUGAI, AICHI, JP |
发明人 |
MORI, HIROSHI, CHITA, AICHI, JP;TAKAHASHI, TATSUHIKO, NAGOYA, AICHI, JP;HASEGAWA, AKIRA, INUYAMA, AICHI, JP |