发明名称 PATTERN MATCHING APPARATUS
摘要 PURPOSE:To accurately locate a pattern on a wafer without a fear of causing a flaw by presetting the reference surface of wafer for positioning and providing a non-contact type distance detector at the area isolated from such reference surface. CONSTITUTION:A wafer for calibration is placed on a table 3 and the table 3 is shifted to the right and left and also vertically. Thereby, the area of calibration wafer opposing to the non-contact type distance detector 14 is caused to match the reference surface A. At this time, a detecting output is stored in a controller 15. Next, a wafer 1 to be processed is placed on the table 3, a pulse motor 11 is operated by the controller 15. Thereby, a support table 4 is driven vertically and the motor 11 is caused to stop at the point where an output of detector matches the stored detection output. Thereby, the wafer 1 accurately matches the reference surface A. In above operations, since the wafer 1 does not caused to be in contact with the detector 14, it does not receive any damage due to contactness.
申请公布号 JPS58225634(A) 申请公布日期 1983.12.27
申请号 JP19820106919 申请日期 1982.06.23
申请人 HITACHI SEISAKUSHO KK 发明人 INAGAKI AKIRA
分类号 G03F9/00;H01L21/027;H01L21/30;H01L21/68;(IPC1-7):01L21/30 主分类号 G03F9/00
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