| 摘要 |
PURPOSE:To increase a number of molds in a single molding process by executing the transfer molding through stacking of a plurality of thin molding forces between the upper and lower heating plates. CONSTITUTION:The top force 14 and bottom force 15 of thin molding forces are formed rather thicker than the depth of cavity and a pot 17 is provided through the forces except for the bottom force. These thin mold forces previously comprising a lead frame are stacked in plural stages and are set between the upper and lower forces 10 and 11. These forces are clamped by a clamping cylinder 2, resin is supplied to the pot 17, resin is supplied to a multi-stage molding force 13 with an injection cylinder 3 for molding. After the molding, the molding force 13 is removed from the molding machine 1 and a resin-molded semiconductor device is separated. According to this method, a number of molds in a single molding can be increased by setting thin molding forces in the plural stages. |
