MANUFACTURE OF HYBRID INTEGRATED CIRCUIT

摘要

PURPOSE:To easily connect conductors formed on both surfaces of a substrate by a method wherein the conductors are connected between both the surfaces of the substrate by providing a through hole of approx. 0.5mm.phi on a snap-off line of the substrate and then forming the conductors thereon. CONSTITUTION:The conductor 2 is formed on both the surfaces of the substrate 1 by proving the through hole of approx. 0.5mm.phi at the position, on the snap-off line 9, wherein the conductors 2 of the substrate 1 are to conduct. Thereby, the conductors 2 on both the surfaces are conducted via the through hole 12. Then, both are electrically conducted at the end surface parts of the conductors 2-1 and 2-2 by snapping the substrate 1 along the snap-off line 9.