| 摘要 |
PURPOSE:To suppress the generation of a defect such as peeling of a mask pattern by embedding opaque metal such as Ta or Cr on a groove part formed by removing a part of a substrate consisting of quartz or glass. CONSTITUTION:A resist film 3 is applied to the surface of the mask substrate 1 consisting of quartz or glass and the resist film 3 is exposed by electron beams or laser beams to form a resist pattern 4 through a developing process. Then, wet etching or dry etching is executed by using the resist pattern 4 as a mask and a thin film 2 consisting of Cr, Ta or the like interrupting the transmission of light such as ultraviolet rays is evaporated or sputtered so as to be stuck in accordance with the coating status of the pattern 4. Finally, the thin film 2 adhering to the surface of the pattern 4 is peeled together with the pattern 4 to form a photomask having a mask pattern 5. |
