| 摘要 |
PURPOSE:To eliminate the shift of location of a chip at chip die bonding, by providing a projection to prevent the shift of location of the chip or a sub- chip and fixing the chip. CONSTITUTION:The position of the sub-chips 1,2 is fixed by providing a projection 7 for a spot facing of a board 3. Since the spot facing 5 is formed on the board 3 by shaping a glass epoxy board with an NC machine, it is easy to perform spot facing processing so as to leave the projection 7. Thus, in a device of multi-chip structure where several sub-chips are placed on one substrate, this method is effective judging from the interval of chips, dispersion of an angles among the chips, and ease of die bonding. |
