发明名称 Cu-Ag base alloy brazing filler material
摘要 PCT No. PCT/JP81/00189 Sec. 371 Date Apr. 16, 1982 Sec. 102(e) Date Apr. 16, 1982 PCT Filed Aug. 25, 1981 PCT Pub. No. WO82/00790 PCT Pub. Date Mar. 18, 1982.A Cu-Ag alloy brazing filler material with low Ag content that exhibits excellent brazability and has a low vapor pressure is disclosed. The filler material comprises 5 to 35% by weight of Ag, 2.5 to 13% by weight of Si, with the balance being Cu and incidental impurities. The properties of the filler material can be improved further by addition of at least one element selected from the group consisting of Sn, In, Fe, Ni, Co, B and Li.
申请公布号 US4416853(A) 申请公布日期 1983.11.22
申请号 US19820373498 申请日期 1982.04.16
申请人 MITSUBISHI KINZOKU KABUSHIKI KAISHA 发明人 MORIKAWA, MASAKI;YOSHIDA, HIDEAKI;KISHIDA, KUNIO;TANAKA, CHUJI
分类号 B23K35/30;(IPC1-7):C22C9/00 主分类号 B23K35/30
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