| 摘要 |
A strip (Fig. 1) for the production of solderable metal covers (Fig. 5) for sealing housings of ceramic material which contain a semi-conductor or an integrated circuit is less than 0.5 mm thick, and consists of a metal carrier 4 which has a thermal co-efficient of expansion similar to that of the housing material and is provided with a solder layer 1 having spaced recesses 2 or cut-outs arranged at a distance from each other. <IMAGE> |
