发明名称 SEALING DEFECT DETECTING METHOD FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To detect a defect by means of an X-ray image by a method wherein a liquid resisting X-ray penetration is allowed to enter a defect in a semiconductor device sealed in such material as resin that X-ray pass through with ease. CONSTITUTION:An iodine preparation (resisting X-ray penetration) is contained in a pressure vessel. A semiconductor device is placed in the liquid to be subjected to a pressure of 4-5kg/cm<2> for several hours. The semiconductor device, upon completion of the process, is rinsed, exposed to X-ray radiation, for the display on a CRT of the image produced by X-ray penetration. Iodine preparation 6', 7' invading into a crack 6 or slit 7 is clearly detected. By using this method, a defect if any is clearly detected, and the route of infiltration of the iodine preparation is observed.
申请公布号 JPS58188143(A) 申请公布日期 1983.11.02
申请号 JP19820070870 申请日期 1982.04.27
申请人 NIPPON DENKI KK 发明人 TAKEI TERUMUNE
分类号 H01L21/56;H01L21/66 主分类号 H01L21/56
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