| 摘要 |
The LED (Light Emitting Diode) lamp unit is provided to reduce the thickness of product by mounting LED elements along the printed circuit pattern in the baseboard. The circuit pattern(21) is printed on the plastic base board(20) having the predetermined thickness. The LED element(10) is mounted on necessary location by the printed circuit pattern. The plastic base board has the bent portion protruded to the upper side or the bottom surface. The through-holes are formed on the circuit pattern for the generation of heat of mounted LED elements excluding the circuit pattern part of the plastic base board.
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