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发明名称
METHOD FOR INSPECTING THE BONDING STATE OF RFID CHIP USING DUMMY BUMP AND DUMMY PATTERN
摘要
申请公布号
KR100889636(B1)
申请公布日期
2009.03.20
申请号
KR20070060194
申请日期
2007.06.20
申请人
发明人
分类号
G01R31/00;G01R27/00
主分类号
G01R31/00
代理机构
代理人
主权项
地址
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