| 摘要 |
<p>PURPOSE:To reduce distributed capacity to be generated between electrodes for a capacitor in a dielectric substrate and a conductive film on the substrate by a method wherein a porous dielectric is formed on the surface of the dielectric substrate, and moreover a minute dielectric film is formed on the surface thereof. CONSTITUTION:The dielectric laminate constituted by lamination of the inside electrodes 2 and dielectric films 1 constitutes the capacitor, and has outside terminals 3 on the sides thereof. The dielectric laminate is consisting of BaTiO5, for example, and has the porous dielectric 4 consisting of TiO2, etc., on the surface thereof. The minute dielectric film 5 consisting of TiO2, etc., is formed on the surface of the porous dielectric 4, and moreover the conductive film 6 of Ag-Pd, etc., is formed thereon. Then the electronic circuit parts of a resistor 7, a transistor 8, etc., are connected electrically to the conductive film 6 thereof. The porous dielectric has a small and apparent dielectric-constant, and distributed capacity between the inside electrodes 2 and the conductive film 6 can be reduced extremely.</p> |
