Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same.

摘要

A printed wiring board of this invention can be obtained by the steps of: making holes in the necessary portion of a copper-clad laminate; forming a catalytic layer on said hole walls and copper foil by pretreatment for electroless plating; forming an etching resist film on necessary lands and circuits; melting-off the copper foil and catalytic layer on the unnecessary portion of said copper-clad laminate by etching; melting-off or retaining said etching resist film; and forming an electroless copper plated film on said catalytic layer; or forming a solder resist film on the necessary portion before or after said electroless copper plated film is formed.