| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a through electrode substrate capable of reducing the number of steps, shortening a manufacturing period, and improving a yield.SOLUTION: A method for manufacturing an interposer, comprising: forming an altered layer on a first substrate; forming a multilayer wiring structure including a first wiring layer in contact with the altered layer and a second wiring layer connected to the first wiring layer via in insulating layer on the first substrate; mounting a chip including an electronic circuit on the multilayer wiring structure via a first bump in contact with the second wiring layer; sticking a second substrate to the side opposite to the first bump of the chip via an adhesion layer; thinning the first substrate from the side opposite to the multilayer wiring structure of the first substrate by first etching; selectively removing the altered layer from the side opposite to the multilayer wiring structure of the first substrate by second etching and forming a through hole for exposing the first wiring layer through the first substrate; and forming a second bump connected to the first wiring layer.SELECTED DRAWING: Figure 1 |
