| 摘要 |
PURPOSE:To realize a radiator easy to handle and high in efficiency by a method wherein a radiator is constituted of a stem and fins extending laterally therefrom and an end of the stem has a hole provided length-wise and the other end has a semiconductor package attached thereto. CONSTITUTION:An end of a stem 3 for radiating fins is provided with a hole 5 whose depth is dependent on the type of an IC to be provided with said fins. Assembly is completed when the other end of the stem 3 is bonded to an IC package 1. The small diameter pant 7 of a chuck 6 is inserted into the hole 5 to be attracted by evacuating 8 and then the chuck 6 is moved for a right position, when the leads 11 of the assembly is bonded to pads 23 on a printed board 22. The type of the IC package can be learned by measuring the depth of the hole 5. Radiating efficiency is lifttle affected by the providing of the hole 5. |
