| 发明名称 |
ELECTROPLATING WITH A SELECTIVE INCREASE OF THE DEPOSITION RATE |
| 摘要 |
<p>A method for high resolution maskless electroplating is described. Preferential plating results from exposing those regions where enhanced plating is sought to a collimated energy beam. Such exposure can produce an enhancement in the plating rate of 103, which is sufficient to eliminate the necessity of masking the surface.</p> |
| 申请公布号 |
EP0018500(B1) |
申请公布日期 |
1983.10.05 |
| 申请号 |
EP19800101626 |
申请日期 |
1980.03.27 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MELCHER, ROBERT LEE;VON GUTFELD, ROBERT JACOB |
| 分类号 |
C25D5/00;C25D5/02;H01L21/288;H01L21/768;H05K3/24;(IPC1-7):25D5/02 |
主分类号 |
C25D5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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