| 发明名称 |
ETCHING PROCESS WITH VIBRATIONALLY EXCITED SF.SUB.6 |
| 摘要 |
<p>SA9 80 049 ETCHING PROCESS WITH VIBRATIONALLY EXCITED SF6 of the Invention A substrate which forms a volatile fluoride is etched and directionality is achieved using vibrationally excited SF6 which has been exposed to laser irradiation. The substrate is etched through a mask having openings smaller than the diffraction limit of the laser light.</p> |
| 申请公布号 |
CA1153674(A) |
申请公布日期 |
1983.09.13 |
| 申请号 |
CA19820399150 |
申请日期 |
1982.03.23 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHUANG, TUNG J.;COBURN, JOHN W.;KAY, ERIC |
| 分类号 |
H01L21/302;C23F1/12;H01L21/3065;H01L21/3213;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/302 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
