| 摘要 |
PURPOSE:To obtain a uniform loop shape by press-bonding fine wirings, deciding a distance from the bonded part, feeding a core rod from a device, engaging the fine wirings, holding the gradient of a loop constantly and then press-bonding the other end. CONSTITUTION:After fire wirings 2 are press-bonded to the electrode 14 of a semiconductor element 6, a capillary is pulled up, a rod 12 is fed from a device to between the electrode 14 and an external lead terminal 8, and driven in X and Y directions, thereby adjusting the gradient theta of a loop to the prescribed value. Then, the capillary is passed on the rod 12 to the terminal 8, and the wirings 2 are press-bonded. The gradient theta is adjusted at the position of the rod 12. According to this structure, the element has a plurality of electrodes, and even in the case that the element has external lead terminals of different moving distances of the capillary, the loop shape can be uniformed, and since the loop shapes are uniform, the variation in the lifetime of the moisture resistant cycle of the bonded part can be reduced after sealed with resin. |
