| 摘要 |
A molding compound for semiconductor device having a Barcol hardness of 80 or more after curing contains as a base resin a thermosetting resin and as a filler a silicate having a chain combination structure or a two-dimensional network structure. The silicate is suitably enstatite, wollastonite; rhodonite, anthophyllite, tremolite, kaolinite or talc. |
