摘要 |
PURPOSE:To obtain the semiconductor supporter having excellent heat-resisting property by adding a superfine carbide forming element to a reticulate Cu-C composite material. CONSTITUTION:When a reticulate Cu-C fiber composite body is heated at the softening point or more of a Cu matrix, C fibers forcedly curved used for the composite body release elastic energy because the elastic modulus of the C fibers is remarkably large, and the weak section of the Cu matrix is broken. When a carbide is manufactured with C, an element with the melting point higher than Cu is added and the C fibers are fixed mutually, a composite material for supporting the semiconductor, which does not expand and is not broken by heating, is obtained. Cr, Zr, Ti... Are used as the element, and one kind in these elements may be made contain by the maximum limit or more of melting number. When the element is changed into supefines with approximately 100Angstrom powder diameters, mixed with methyl cellulose and used, the C fibers can mutually be combined strongly and evenly because the element intrudes sufficiently among the Cu-C fibers in approximately 10mum and fine powders are dispersed uniformly. |