发明名称 |
Integrated circuit device connection process |
摘要 |
A method for forming electrical interconnections in an integrated circuit which involves forming an insulating layer on the silicon chip on the lower of two conductive layers to be interconnected, opening a window in the insulating layer, filling the window with a metallic plug by a lift-off technique, and then forming an interconnection pattern extending over the layer and contacting the plug.
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申请公布号 |
US4392298(A) |
申请公布日期 |
1983.07.12 |
申请号 |
US19810287439 |
申请日期 |
1981.07.27 |
申请人 |
BELL TELEPHONE LABORATORIES, INCORPORATED |
发明人 |
BARKER, ROBERT A.;ONG, EDITH C. |
分类号 |
H01L21/027;H01L21/768;(IPC1-7):H01L21/28 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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