| 摘要 |
PURPOSE:To improve the radiation effect with a larger chip size of a drive integrated circuit by arraying drive integrated circuits each comprising two sets of drive circuits the same in the mechanism in several trains and regularly. CONSTITUTION:Heat generating elements R1-R8 and heat generating elements R17-R24 are connected to a drive integrated circuit IC101 at the upper stage A, heat generating elements R9-R16 and heat generating elements R25-R32 to a drive integrated circuit IC102 at the lower stage B, heat generating elements R33-R40 and heat generating elements R49-R56 to a drive integrated circuit IC103 at the upper stage A and heat generating elements R41-R48 and heat generating elements R57-R64 to a drive integrated IC104 at the lower stage B. Likewise, heat generating elements are connected to drive integrated circuits sequentially. In this case, recording signals D are trnasferred to the drive integrated circuits sequentially in the order: KC101 IC102 IC101 IC102 IC103 IC104 IC103 IC104 ... ICm+100. This enables the transferring of the recording signals D of 16Xm bits. |
