| 摘要 |
PURPOSE:To prevent the pressing out of a binder, and to hold conformability of the input/output parts or the junction parts between substrates of the IC by a method wherein escape grooves are provided in a metal case or a metal carrier to mount the microwave IC. CONSTITUTION:The grooves 8 are provided on the microwave IC mounting face 7 of the metal case body 1 in the longitudinal and the lateral directions at the IC input/output parts 9, 9' and the junction parts 10 between the IC substrates as to make the substrates 2, 2' and the case body 1 to come in contact mutually with the necessary lowermost narrow contact areas 11, 11', 12. The substrates 2, 2' are put on the case body 1 interposing the binder 4 of buffer metal or solder, etc., between them, and are pressed by pressure to be fixed with metal tools 6, 6'. The conductor patterns 3 of the respective IC's are connected with ribbons 13, and the input/output parts are connected to coaxial terminals 5, 5'. According to the construction thereof, even when the binder 4 is pressed by the substrates 2, 2', the binder is not forced out toward the IC input/output parts and the junction parts between the substrates according to the grooves 8, and moreover, because the contact faces 11, 11', 12 have the small area, the pressing out quantities are minute, and no influence is applied to the input/output parts. |
