| 摘要 |
PURPOSE:To improve the heat shock resistance by an arrangement wherein a stress buffer layer is formed near the joint portion of a hub at end faces of through-holes of a honeycomb structure and the latter, while said stress buffer layer has a thermal expansion coefficient which has little difference from that of the hub. CONSTITUTION:A stress buffer layer 6 is formed near the joint portion A of a hub 4 in at least one end face 5, 5' in which through-holes 2 of a honeycomb structure 1 opens and the structure 1. By such an arrangement, part of the through-holes 2 of the honeycomb structure 1 which is kept in contact with the hub 4 is blocked so that high temperature fluid or low temperature fluid is not allowed to flow through the through-holes 2 in that region. Further, the heat conductivity in that region is as small as about one sixth of that of the hub 4 so that a reduced temperature gradient and an improved heat shock resistance can be obtained. Moreover, the heat shock resistance can be increased further by forming the stress buffer layer 6 with a material having a thermal expansion coefficient which differs from that of the hub 4 by 0.1% or below at 800 deg.C.
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