| 发明名称 |
Sublimation patterning process |
| 摘要 |
A method for patterning layers of material on a substrate without photoresist by using a selective sublimation process. Differences in thermal conductivity of materials underneath a layer of material to be patterned cause patterning by sublimation over areas of low thermal conductivity, initiated by a pulsed or swept radiated energy source.
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| 申请公布号 |
US4388517(A) |
申请公布日期 |
1983.06.14 |
| 申请号 |
US19800189495 |
申请日期 |
1980.09.22 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
SCHULTE, ERIC F.;PORTER, VERNON R. |
| 分类号 |
H01L21/302;H01L21/3065;H01L21/321;H01L21/768;H05K3/14;(IPC1-7):B23K27/00 |
主分类号 |
H01L21/302 |
| 代理机构 |
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