| 摘要 |
PURPOSE:To contrive to enhance mounting density and reliability to connecting parts of the semiconductor device by a method wherein semiconductor chips of the plural number are connected by an insulator arranging one side flat, and after it is fixed on a wiring substrate, metal wirings are laid. CONSTITUTION:A film 8 is adhered on a flat stand 7, the semiconductor chips 2 are adhered closely, and gaps between the chips are buried with epoxy resin 9. After resin is hardened, the film 8 is peeled off from the integrated element 10. The integrated element 10 is accommodated in a concave part 11B of the ceramic substrate 11 placing the flat face 13 upward interposing epoxy resin between them, the top part 11A and the face 13 are held in the same plane, and resin is hardened to fix. Polyimide resin is applied on the surface, resin 9 in the gaps only is left removing other resin, and wiring layers 4 on the surface 11A and junction pads 3 of the chips 2 of the integrated element 10 are connected with the metal wirings 15 adhered closely on the plane 13. Because the wirings 15 are decided by precision of the photo etching process, high density mounting can be attained, and moreover because connection using wire is not necessitated, reliability is enhanced. |
